SMIDA Vacuum Mixer for Epoxy & Potting Compounds1

Epoxy potting compounds protect transformers, power modules, LED drivers, and battery packs from moisture, shock, and short circuits.
But the quality of a potted component is decided in the mixing bowl, not the curing oven.

Three problems follow a badly mixed compound:

•Filler agglomeration — alumina and boron nitride clumps break the thermal path and create hot spots;

•Entrapped air — bubbles become voids after curing, cutting dielectric strength and surface quality;

•Heat build-up — friction accelerates the epoxy reaction and shortens your working window.

The SMIDA Process

1.Premix — combine A/B components and filler at 1000–1500 rpm for 1–3 minutes;

2.Vacuum degas — 0.2 kPa-class vacuum for 2–5 minutes pulls microbubbles out;

3.Check and pour — confirm no agglomerates or bubbles remain, then dispense.

Run the whole cycle on a temperature-controlled model.
SMIDA's TTC series holds the compound between -15 °C and 25 °C, suppressing heat build-up and extending pot life so your dispensing team is not racing the clock.

Why Blade-Free Matters for Epoxy

Hard fillers grind down impeller blades, and the metal debris ends up inside the compound — an insulation-failure time bomb.
SMIDA's non-contact design means epoxy touches only the cup: no wear, no debris, no contamination.

Quick Answers

Why is temperature control recommended for epoxy?

Epoxy reacts faster as temperature rises; uncontrolled mixing heat shortens pot life and can cause partial gelation.

Can it replace a vacuum chamber?

For high-viscosity epoxy, yes — and much faster.
Centrifugal force actively drives bubbles out while the vacuum removes them.

Can you test my formula?

Yes.
Send a sample and we will run it on a temperature-controlled SMIDA mixer and share the before-and-after results.

For the full technical guide, read Epoxy Potting Compound Bubbles: How Vacuum Mixing Protects Encapsulated Electronics.