SMIDA planetary centrifugal mixer: optimization scheme for conductivity of silver slurry mixing

Silver paste, as the core conductive material of electronic components, can directly cause problems such as broken conductive paths and signal transmission attenuation if stirred unevenly. Traditional stirring often leads to silver particle aggregation (diameter exceeding 8 μ m) and bubble wrapping (3-5 bubbles per milliliter), causing the defect rate of end products to climb to 20%, seriously restricting production efficiency. ​

1、 Mixing effect of silver paste: comparison between traditional method and SMIDA equipment testing
Regarding the physical properties of silver paste (including nano silver paste, micro silver paste, and high solid content silver paste), SMIDA has achieved a leapfrog improvement in mixing effect through the "centrifugal extrusion+multidimensional shearing" technology. The measured data of key indicators are as follows:

Evaluation dimensions                      Uniformity of silver particle dispersion                Residual amount of bubbles 
Traditional mixing equipment             65% -78%, with significant local agglomeration     3-5 pieces/ml (diameter 0.08-0.3mm) 
SMIDA planetary centrifugal mixer     ≥ 99.2%, silver particle size deviation ≤ 0.8 μ m     ≤ 0.3/ml, bubble diameter ＜ 0.03mm 

Square resistance stability                Uniformity of silver paste solid content      Printing formability 
Fluctuations ± 10% -15%                   Deviation ± 5% -8%                                         Easy to cause grid breakage and ink leakage 
Fluctuations ≤ 1.5%, conductivity      Deviation ≤ 0.5%, no stratification                  Smooth printing lines and reduced 

consistency fully pulled up                 phenomenon                                                   grid breakage rate to 0.3%  
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2、 Core application scenario of silver paste mixing: SMIDA equipment landing effect
The SMIDA mixer has been adapted to meet the production needs of silver paste in multiple fields, solving the mixing pain points in different scenarios:
1. LED chip packaging field
Used for bonding silver paste on LED chips, the silver particles are evenly dispersed after stirring, and the welding yield between the chip and the bracket is increased from 82% to 99.5%. After packaging, the LED light decay rate is reduced by 15%, and the service life is extended by more than 5000 hours. ​
2. Radio Frequency Identification (RFID) tag field
After stirring with SMIDA, the silver paste used for RFID antenna has no bubbles or silver particles aggregation. The tag reading distance has been increased from 5 meters to 6.5 meters, and the reading success rate has increased from 90% to 99.8%. It is suitable for high-frequency identification scenarios such as logistics and retail. ​
3. Flexible display field
The transparent conductive silver paste of flexible OLED screens can achieve uniform coating of ultra-thin (50nm) after stirring. After bending 1500 times, the conductivity performance deteriorates by only 3% (compared to 18% after traditional stirring), meeting the long-term use needs of foldable screens. ​
4. Automotive electronics field
High temperature silver paste is used for automotive sensors, and its high-temperature resistance is improved after stirring. In cyclic tests from -40 ℃ to 150 ℃, the conductivity stability remains above 98%, avoiding signal false alarms caused by silver paste failure in sensors. ​

3、 Silver paste exclusive mixing design: details solve practical problems
Anti settling mixing trajectory: The combination of "inclined self rotation+eccentric revolution" is used to avoid silver particle settling when the silver slurry is stationary. After mixing, the silver slurry can be stored stably for 48 hours without layering. ​
Online sampling port design: The equipment reserves a sterile sampling port, which can detect the dispersion of silver paste without stopping the machine, reducing production interruption time and improving batch stability. ​
Low shear protection function: For nanoscale silver paste, the stirring force is automatically adjusted to avoid the decrease in conductivity caused by silver particle breakage, ensuring that the original properties of the silver paste are not damaged. ​
Get free silver paste mixing and testing services

If you are facing production problems caused by uneven mixing of silver paste, contacting SMIDA can enjoy:
✅ Free silver paste sample mixing, contact SMIDA
Good mixing to maximize the conductivity of the silver paste.