Uniform and Bubble free Conductive Adhesive Enhancement Scheme

The core function of conductive adhesives is to construct stable conductive pathways, and their performance depends entirely on the mixing quality of conductive fillers (silver powder, copper powder, carbon nanotubes, etc.) with the adhesive matrix. Traditional stirring can easily cause the agglomeration of fillers to form an "insulation zone", bubbles to block the conductive path, and uneven color affects the consistency of appearance, directly causing failure problems such as poor contact of electronic components and interruption of signal transmission. ​

1、 Conductive adhesive stirring: the difference in effect directly hits the core performance
In response to the dual requirements of "conductivity+adhesion" for conductive adhesives, SMIDA has completely solved the pain points of traditional mixing through the integrated technology of "precise mixing+vacuum defoaming":
After traditional mixing: the conductive filler aggregates into particles, and the bubbles inside the colloid are dense; After application, intermittent conductive pathways are formed with large fluctuations in resistance; The color depth varies, the appearance is rough, and the bonding strength decreases due to uneven mixing. ​
After SMIDA stirring: the conductive filler is uniformly dispersed in the matrix without agglomeration or visible bubbles; The conductive resistance is stable and extremely low, forming a continuous conductive network; The color is consistent throughout, the colloid is delicate, and the adhesion and conductivity meet the dual standards.

​
2、 Core application areas of conductive adhesives
SMIDA mixer deeply adapts to key application scenarios of conductive adhesives, solving industry performance bottlenecks:
1. The field of electronic component bonding
Used for conductive bonding between chips, substrates, and sensor pins. The stirred adhesive has stable conductive resistance, avoiding component heating and signal attenuation caused by excessive contact resistance. It is suitable for high-precision packaging requirements such as 5G chips and microsensors. ​
2. In the field of flexible circuit manufacturing
The conductive adhesive interconnection of flexible FPC lines is ensured by SMIDA stirring to ensure even distribution of fillers. After 1000 bends, the conductive path remains intact with a resistance change rate of ≤ 5%, solving the problem of easy disconnection after bending in traditional stirring. ​
3. New energy electrode field
The conductive bonding of lithium battery lugs and supercapacitor electrodes, with no bubbles in the adhesive and uniform fillers, can reduce electrode contact resistance, improve energy conduction efficiency, and assist in optimizing the fast charging and discharging performance of batteries. ​
4. Electromagnetic shielding field
The conductive shielding adhesive for electronic device casings, after stirring, has consistent color and uniform conductivity, with a shielding efficiency of over 40dB, effectively blocking electromagnetic interference and suitable for harsh scenarios such as medical equipment and military electronics. ​

3、 Exclusive mixing design for conductive adhesive
Low shear dispersion technology: While fully dispersing the filler, appropriate parameters are set to avoid excessive shear damage to the molecular structure of the adhesive matrix, ensuring that the adhesive strength does not weaken. ​
Multi mode adaptation function: For different conductive fillers (spherical silver powder, flake silver powder, carbon nanotubes), store exclusive stirring parameters, and switch with one click to achieve the optimal mixing effect. ​

Free access to conductivity testing
If you are troubled by issues such as unstable conductivity of conductive adhesives, color difference, bubbles, etc., contact SMIDA to enjoy:✅ Free sample mixing test
Quick docking:
Official website testing application: www.smidacn.com/
Email: blue_liu@smida.com.cn ​
Let conductive adhesives have the dual advantages of "stable conductivity" and "reliable adhesion". ​