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Solution for uniform and color free mixing of conductive adhesive

Solution for uniform and color free mixing of conductive adhesive

Conductive adhesive is a key "conductive bridge" in fields such as electronics and new energy. Traditional mixing is prone to problems such as filler agglomeration, uneven color, and large resistance fluctuations, resulting in poor component contact and signal interruption. The SMIDA planetary centrifugal mixer uses the technology of "planetary centrifugal shearing+vacuum defoaming" to achieve homogenization without bubbles, uniform color, stable resistance, and is suitable for fields such as electronic packaging and flexible circuits. Sample testing can be applied for free.


As a "conductive bridge" in the fields of electronics and new energy, the performance of conductive adhesive depends entirely on the mixing quality of conductive fillers (silver powder, carbon nanotubes, copper powder) and adhesive matrix. However, traditional mixing often encounters difficulties such as conductive adhesive agglomeration, uneven color, and large resistance fluctuations, which directly lead to poor contact of electronic components and interruption of signal transmission, becoming a key bottleneck restricting product qualification rate. SMIDA planetary centrifugal mixer accurately solves the pain points of conductive adhesive mixing and adapts to the high standard production needs of multiple industries.
1、 Conductive adhesive mixing: traditional equipment vs. SMIDA core differences
In response to the high viscosity of conductive adhesive and the easy oxidation of fillers, SMIDA has achieved a breakthrough from "unstable performance" to "homogeneous high conductivity" through the integrated technology of "planetary centrifugal shear mixing+vacuum defoaming". The comparative effect hits the core:
After traditional mixing, conductive fillers aggregate into "insulating particles", and the dense bubbles inside the colloid block the conductive path; The color of the conductive adhesive in the same batch is mottled and the appearance is rough; The test shows that the resistance fluctuation exceeds 30%, which cannot meet the requirements of precision electronics.
After SMIDA stirring, the filler is uniformly dispersed throughout the entire area, achieving homogeneous mixing of conductive adhesive; There are no visible bubbles throughout the entire process, forming a continuous conductive network; Strong color consistency, fine and smooth colloid; The resistance value is stable and extremely low, and the conductivity and adhesive strength meet the dual standards.
2、 Core application areas of conductive adhesive hybrid (suitable for high-frequency industry needs)
SMIDA mixer deeply matches the mixing requirements of conductive adhesive in different scenarios, solves performance bottlenecks in segmented fields, and covers high attention scenarios of search engines:
1. Electronic packaging and bonding field
Suitable for 5G chip conductive adhesive packaging, sensor pin conductive bonding, PCB board conductive interconnection - the stirred conductive adhesive has stable resistance, avoiding component heating and signal attenuation caused by excessive contact resistance, perfectly meeting the search needs of "electronic packaging conductive adhesive mixer", and helping to upgrade the performance of precision electronic devices.
2. In the field of flexible circuits and wearable devices
Used for flexible FPC circuit conductive adhesive interconnection and smart wristband electrode conductive bonding - achieving bubble free mixing of flexible conductive adhesive, the conductive path remains intact after 1000 bends, and the resistance change rate is ≤ 5%, solving the pain point of "uneven dispersion of flexible conductive adhesive" in the industry and adapting to the lightweight and thinning needs of wearable devices.
3. New energy and energy storage fields
For the adhesive bonding of lithium battery ear conductive adhesive and the conductive coating of supercapacitor electrode - after stirring, the conductive adhesive filler is uniform and there is no difference in contact resistance caused by bubbles, which improves energy conduction efficiency and meets the strict standards of "new energy conductive adhesive mixing equipment", helping to optimize the fast charging and discharging performance of energy storage equipment.
3、 Exclusive hybrid design highlights of conductive adhesive (targeting high-frequency search issues)
Low shear dispersion technology: Adopting a contact type structure, it fully disperses the agglomerated filler while avoiding damage to the adhesive matrix structure, ensuring that the bonding strength of the conductive adhesive does not weaken, and solving the industry problem of "excessive shear affecting the performance of the conductive adhesive". Accurate control of matching time to achieve "consistent color of conductive adhesive" and meet the standardization requirements of electronic product appearance.
Free access to conductive adhesive mixing testing service
If you are searching for "solutions for uneven mixing of conductive adhesive" and "bubble free conductive adhesive mixer" and are troubled by issues such as resistance fluctuations, color differences, and agglomeration, please contact SMIDA to enjoy: ✅ Free sample testing
Quick connection: Official website testing application: www.smidacn.com
Email: blue_liu@smida.com.cn
Choose SMIDA to combine "stable conductivity" and "homogeneous color difference free" conductive adhesive, unlocking new possibilities for precision manufacturing.

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Contact person: Blue Liu
Tel: +86 135 1093 2149
WhatsApp: +86 151 7377 7981
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