Conductive adhesive is a key material widely used in electronic packaging, circuit bonding and other precision fields. Its production requires uniform mixing, efficient defoaming and high-precision dispersion to ensure stable conductivity and excellent application performance.
SMIDA provides a reliable processing solution with two core equipments:
planetary centrifugal mixer and
three roll mill.
In the initial batching stage, the SMIDA planetary centrifugal mixer quickly and evenly disperses micro‑and nano‑scale silver powder, curing agent and other functional fillers into the resin carrier. It effectively controls the viscosity and fluidity of the conductive adhesive, avoids material stratification and lays a stable foundation for subsequent processes.
During dispersion, nano‑fillers tend to re‑agglomerate under the wrapping of carriers, and conventional equipment is difficult to handle high‑viscosity systems. The SMIDA three roll mill provides strong shear and grinding to thoroughly break up agglomerates and refine particles. After treatment, the silver particle size is highly concentrated, with D90 below 3μm, greatly improving the dispersion uniformity and electrical properties of conductive adhesive.
Finally, the dispersed conductive adhesive is defoamed and packaged by the planetary centrifugal mixer, then stored at low temperature to obtain finished products with stable quality. With outstanding performance, SMIDA equipments become the preferred choice for high‑standard conductive adhesive manufacturing.