CT-5050 can choose infrared, green, ultraviolet and other laser configurations to improve efficiency while ensuring effectiveness. It can cut PCBs (PCBA), FPCs, aluminum substrates or other materials within 500 * 500mm.
Optional laser cutter
FPC, PCB and other materials laser cutting machine
Main features:
1. High cutting quality
2. Fast cutting speed
3. Wide range of materials
4. High flexibility
5. High degree of automation
6. Environmental protection and energy conservation
1 unit for sale | 1 unit for customization
Support for multiple purchases | Global after-sales service
Serial Number | Performance Indicators | Parameter |
1 | Machine name | Laser cutting machine |
2 | Model | CT-5050 |
3 | Cutting range | 500*500mm |
4 | Thickness of processable material | ≤3mm |
5 | Platform repeatability | ±2μm |
6 | Comprehensive precision | ±5μm |
7 | Laser type | UV picosecond, infrared picosecond, UV nanosecond, green light optional |
8 | Laser power | Power optional (3-30W) |
9 | Cooling method | Chiller |
10 | Cutting method | Scanning cut by vibrating mirror + lens |
11 | Maximum cutting accuracy | ±0.03mm |
12 | CCD resolution | 500W (optional) |
13 | X-axis travel | 600mm |
14 | Y-axis travel | 700mm |
15 | Z-axis travel | 100mm |
16 | Maximum X/Y single-axis speed | 1000mm/s |
17 | Working mode | Manual loading and unloading |
18 | Industrial vacuum system | Standard |
19 | File Format | dxf format |
20 | Cutting system | SMIDA |
21 | Main equipment power supply voltage | 220V/50Hz |
22 | Working height | 900±30mm |
23 | Industrial vacuum power supply | 220V/50Hz |
24 | Equipment external size | L1600*W1800*H2000mm |
25 | Working environment | Temperature: 25℃±2℃; humidity≤60%; no condensation |
26 | Weight | 800kg |
27 | purpose | Cutting of glass backlight panel, direct light panel, glass paint removal, electronic components, sapphire, camera module, glass enclosure, fingerprint module stainless steel reinforcement sheet, communication products, PCB (PCBA), FPC, aluminum substrate and other materials. |
28 | Total power | 5.5kW |
Total power
With high speed scanning galvanometer, X/Y table adopts gantry structure, marble base, flying light path design, high stability.
Optional picosecond UV laser, nanosecond UV laser, nanosecond green laser, to ensure perfect beam quality , fine spot, fine slit, high cutting precision, in the case of meeting the effect of the highest efficiency of the laser selected to meet the customer's production.
Adopt high resolution, brand CCD and lens to realize high precision, automatic positioning, focusing and other functions, support a variety of visual positioning features, such as cross, solid circle, hollow circle, L-type right-angled edges, image feature points and so on.
The vibrating lens automatically corrects, automatically adjusts focus, realizes automation in the whole process, and adopts the laser displacement sensor to automatically adjust the height of the focus to the table, realizing fast alignment and saving time and trouble.
The suction system can eliminate all the cutting exhaust gas, avoiding the harm to the operator and the pollution to the environment.
Advantage
Optional laser, adaptable to different material characteristics, improves cutting efficiency and quality.
High precision measurement and positioning, adaptable to product deformation, with smoother cutting edges.
Full automation, automatic adjustment, time-saving and labor-saving, improving product consistency.
Adopting a gantry structure, marble base, and flight path design, it has high stability.
The suction system eliminates cutting waste gas and avoids the impact on personnel and the environment.
The suction system eliminates cutting waste gas and avoids the impact on personnel and the environment.